JCU CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 645
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
C07D HETEROCYCLIC COMPOUNDS 1161
 
  
 
C07F ACYCLIC, CARBOCYCLIC, OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM, OR TELLURIUM 169
 
  
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 1119
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 191
 
  
 
C09K MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR194
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1100
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0096,744 PACKING FOR SUBSTRATE PLATING JIG AND SUBSTRATE PLATING JIG USING THE SAMEMar 27, 14Apr 06, 17[C25D]
2017/0044,682 HIGH-SPEED FILLING METHOD FOR COPPERApr 25, 14Feb 16, 17[C25D]
2016/0130,712 ELECTROPLATING SOLUTION FOR TIN OR TIN ALLOY, AND USE FOR SAMEMay 08, 14May 12, 16[C25D]
2015/0294,894 SUBSTRATE PLATING JIGNov 14, 12Oct 15, 15[C25D, H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9865493 Substrate plating jigNov 14, 12Jan 09, 18[C25D, H01L]
9719183 Non-cyanide gold plating bath and method for preparing non-cyanide gold plating bathMay 14, 13Aug 01, 17[C23C, C25D]
9321741 Copper plating bath containing a tertiary amine compound and use thereofApr 30, 10Apr 26, 16[C25D, H01L, C07D, H05K]
9169437 Selective etching methodSep 03, 12Oct 27, 15[C09K, C03C, C23F]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0137,673 SILICON OLIGOMER AND PRODUCTION METHOD THEREFORAbandonedJun 28, 13May 19, 16[C07F, C08G]
2016/0138,181 SUBSTRATE PLATING DEVICEAbandonedMar 27, 14May 19, 16[C25D]
2015/0228,461 PLASMA TREATMENT APPARATUS AND METHODAbandonedApr 21, 15Aug 13, 15[H01J]
2015/0068,890 SUBSTRATE PLATING JIG AND PLATING DEVICE USING SAMEAbandonedApr 20, 12Mar 12, 15[C25D]
2014/0251,798 SUBSTRATE ELECTROPLATING JIGAbandonedOct 19, 11Sep 11, 14[C25D]

Top Inventors for This Owner

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